Enerdyne can thermally characterize electronic components and assemblies within a variety of test platforms and environmental conditions. Silicon die-based Thermal Test Vehicles (TTVs) can be utilized to simulate surface conditions and specific operating heat load/flux. Assemblies may be air or liquid cooled during characterization.
Test Vehicles:
Proprietary Thermal Test Vehicles (TTVs)
- Bare silicon die and copper lidded,
various form-factors
- Ceramic and
organic substrates
- Uniform heat flux
or hot spot, up to 200 W
- Adjustable
clamping force and coldplate
temperatures
- Controlled bondline
thickness (BLT)
Instrumentation:
Agilent Data Acquistion System
- Bare silicon die and copper lidded,
various form-factors
- Ceramic and
organic substrates
- Uniform heat flux
or hot spot, up to 200 W
- Adjustable
clamping force and coldplate
temperatures
- Controlled bondline
thickness (BLT)
Environments:
- Elevated Temperature
- Temperature and Humidity
- Vacuum or Inert gas
