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 Indigo™ is an ultra-high performing phase change metal alloy thermal
interface material (TIM), Enerdyne's breakthrough Indigo™ system offers higher performance
at reduced cost.
Indigo is available as a preform to integrate painlessly into your
existing package, or it can be pre-applied to the underside of a heat spreader or lid
for ease of assembly.
With its excellent wetting and high bulk conductivity, the Indigo TIM offers dramatically lower
thermal resistance than competing products.
Indigo2™ TIM2 Properties
Important Benefits
- TIM Thermal Impedance < 0.04°C-cm2/W (@ 2mil BLT)
and Thermal Conductivity of > 20 W/mK
Indigo has outstanding thermal conductivity-as much as 3 times better than the best
silver-filled greases. Indigo is unmatched by any other materials except solders,
and unlike solders, Indigo can be used between materials without matching Coefficients
of Thermal Expansion (CTEs) such as between silicon dies and metal heat sinks. With the
big reduction in thermal resistance Indigo provides, the demands on heat sinks and fans
are relaxed, leading to many desirable results: decreased costs, quieter operation, and
form-factor reductions
- Allows inexpensive, efficient spreaders without restrictions of CTE matching
As a liquid at operating temperatures, Indigo alleviates the restriction of matching
thermal expansion rates of the die and spreader. Common composites like AlSiC may avoid
mechanical stress with other TIMs by matching the thermal expansion of the silicon chip.
They are far inferior, however, to the performance of a range of materials, like a copper
lid (~380 W/mK bulk conductivity). Despite copper's CTE incompatibility with silicon,
Indigo's compliance allows the use of this significantly cheaper heat spreader. The
cost advantage: Indigo with a nickel-plated copper lid requires less than 1/3 the cost
of AlSiC, Cu-Mo and Cu-W spreaders with matching TIMs. The increased performance allows additional savings on other
components, notably the heat sink and fan.
- Relieving noise from fans and blowers
Indigo also addresses a key emerging issue in the electronics industry-acoustics.
For comfort in the home, and for safety in the workplace, the trend of increasing
fan noise must be reversed. Indigo, by increasing the performance and efficiency of
heat sinks reduces the need for enhanced airflow. By shrinking, slowing, or even
eliminating fans, Enerdyne Solutions Indigo is a leading solution to the increasingly
troublesome noise of fans and blowers.
Easy & effective
- Outstanding reliability proven by extensive testing
Indigo passes environmental test conditions for OEM servers with negligible performance change over end-of-line(EOL).
- Unmatched performance at low clamping pressure: as little as 5psi.
Some thermal interface materials can achieve relatively good performance, and some make aggressive
claims that can only be achieved by clamping pressures of as much as 80 psi or the use of unrealistically
thin bond lines. Because Indigo uses a low melt alloy, desirably thin bond lines can be readily achieved.
Due to Indigo's superior wetting, and hence low contact resistance, it achieves great performance with low
clamping pressures. Modest increases in clamping pressure can yield additional performance gains.
The choice of a phase change metal alloy (PCMA) in Enerdyne Solutions' Indigo makes it the clear winner over all alternatives
for a high-performance thermal interface:
Indigo can provide many advantages and benefits to customers, including enabling production
of otherwise unviable products, and increase of gross margins by reducing the COGS, or the
offering of product at a lower price while maintaining margins. The higher performance of
Indigo permits the use of smaller and cheaper heat sinks and fans, reducing costs and form factor.
Additionally, Indigo transmits heat more efficiently to the heat sink, and mediates thermal
expansion mismatches without loss of performance. This permits the construction of
higher-performance systems of faster clock speeds and greater power consumption,
meeting demand for end users' growing computational power. The smaller size and
lighter weight of an Indigo-enabled solution allows increased design flexibility,
and more truly portable appliances since it solves present design barriers to advancing
integrated circuit miniaturization and complexity. Manufacturers can increase market share
by offering a product with these superior characteristics their customers demand.
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