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For most applications, the deployment of Enerdyne Solutions' Indigo and Polara products can be
accomplished readily and simply. Both are built of normal industrial materials and deployed
using standard manufacturing and assembly processes. Owing to its ease of incorporation and the
Company's focus on research and development of great thermal management products, there are no
current plans to construct a production manufacturing facility. Enerdyne Solutions licenses
designs to customers or may establish manufacturing partnerships in the future. Both technologies
have options that balance performance with design-in complexity, so customers can readily find the
right approach to match the specific need.
Indigo
The Company's Indigo product is an advanced Thermal Interface Material (TIM) consisting of a
high-conductivity material and integrated corrosion mitigation technology. It is designed to
serve as a thermal interface between two surfaces, and is best used as a TIM1 between a die
and the integrated heat spreader (IHS) lid of a package. In this configuration the Indigo
PCMA would replace another, lower-performing grease or other TIM. Following proper preparation
for PCMA compatibility, the existing integrated heat spreader lid could be used. Alternatively,
the ability of the PCMA to mediate between materials of different, incompatible Coefficients of
Thermal Expansion (CTEs) allows the selection of other lid materials for increased performance
and reduced cost (for example replacing AlSiC with copper.)
For bare die or flip chip applications, Enerdyne Solutions can supply a suitable lid custom
designed for the specific configuration, and compatible with the Indigo PCMA. Attachment is
done directly to the chip package or PCB using a lid seal. Dielectric layers can be readily
added as necessary.
Indigo may be applicable in some cases as a TIM2 between the case (outside of the package)
and the base of a heat sink or heat absorbing junction of a heat pipe. Because of the need
to form a seal between the two surfaces, applications where removal and replacement of the
heat sink is expected may not be suitable at this time. While an Indigo interface can be
reworked in general, it is not expected that end-users will have the expertise, materials,
or tools to do this reliably. However, where the interface is in an application that is not
directly serviceable by the end-user (e.g. sealed boxes such as game stations or certain
wireless devices) the use of an epoxy or other lid seal may be acceptable.
Because of the nature of the PCMA, Indigo will not be suitable as a commoditized material
sold in volumes to manufacturers or in tubes at retail. Implementation must include its
packaging which requires some degree of preparation of the interface surfaces, and the
inclusion of mitigant components to provide long term interface performance reliability.
Manufacturing and deployment of the product is simple, nevertheless: Indigo is constructed
of standard materials and normal industrial processes. Many customers already possess most
or all of the knowledge and equipment necessary. Clamping pressure, for instance, can be as
little as 10 psi for a bond line thickness of < 1 mil and excellent performance, due to
Indigo's superior wetting. With only modest increases in clamping pressure, additional
performance can be achieved.
Polara
Enerdyne Solution's unique Polara technology offers flexible deployment options
for manufacturers. Polara, depicted below in blue, can be assembled as a discrete
component between the bare die or flip chip and the heat sink, or at various levels
of integration, from package, through substrate and all the way to die level. The
higher the level of integration, the greater the performance gain.
Polara can be constructed to match the CTE of both silicon and gallium arsenide (GaAs)
chips. The matching thermal expansion allows a chip to be directly bonded to the heat
spreader, thereby mitigating thermal interface resistance common in typical die
adhesives. Polara is readily adaptable to many existing integrated circuit (IC)
packages such as the flip chip BGA seen here:
There are many ways of performing the die attach with Polara. A typical bonding
construct could look like this:
For die temperature planarization, Polara can be customized to specific "chip level"
thermal profiles and attached with a eutectic alloy or wafer bond. The versatility and
performance of this thermal management technology is also an attractive solution to the
heat issues of many other technologies, including:
- 3D chip packaging
- System in Package (SiP)
- MEMS/MOEMS devices
- Optical components
- Silicon-on-Insulator (SOI)
To discuss your application and the specifics of a Polara deployment,
contact us today.
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