Enerdyne's experienced engineering staff has collectively more than 80 years of multi-disciplinary scientific expertise in such diverse and complementary fields as electronic, chemical, thermal, metallurgical, mechanical, optical, computer, and materials engineering. The team has a formidable array of capabilities and competencies, including a large variety of electro-less and electroplating chemistries, conversion coatings and chemical etch processes, powder metallurgical sciences, controlled atmosphere sintering, hot isostatic pressing, diffusion bonding, thermoelectricity, electronic packaging, heat transfer and materials science. Our seasoned veterans come with histories of achievement from many successful companies including Texas Instruments, Johns Hopkins Applied Physics Laboratory, Coinstar, Schlumberger, and Microsoft.

Let us put that expertise to work for you. Contact us with the details of your application and your thermal needs. Polara and Indigo each are very well-suited to a broad spectrum of cooling applications, but we won't hesitate to recommend another company and its products if that is the right answer for your needs.

At Enerdyne Solutions we have considerable experience in the technical analysis necessary to accurately model thermal performance of many different kinds of devices.

Our modeling takes into account all aspects of your thermal requirements, such as materials, die size, power, heat flux variations, packaging, size and weight constraints, ambient conditions, ruggedization constraints, and target junction temperature. We can provide the technical data customers require to properly assess whether an Indigo™ or Polara™-enhanced solution is the best match for the thermal needs, and how they compare to other technologies and approaches. See some thermal modeling examples.

We look forward to working with you. Contact us today and we'll get started on modeling a solution customized for your exact needs.