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These corrosion and oxidation products are much more thermally resistive than the original PCMA. The
result is unacceptable performance degradation that can, sometimes in just a couple days, lead to
catastrophic thermal failure of the device to be cooled.
Because they are liquid at operating temperature PCMAs must also be deployed in a fashion to prevent
failure due to the material migrating away from the interface (so-called drip-out.) Depending on their
formulation LMAs may also share with greases the problem of thermal pump-out, or material migration
due to thermal cycling. In some applications (e.g. portable computing devices) the interface may be
subjected to abrupt and extreme mechanical stresses that could lead to the LMA being jarred loose
from the interface (so called shake-out.) Migration of the PCMA would be a serious problem both
because of the potentially rapid rise in thermal resistance if the interface de-wets, and also
because PCMAs are generally electrically conductive; migration into contact with other electronics
can cause short-circuits.
Another issue is that some PCMA constituents react when in contact with certain other materials. Such
reactions create intermetallic compounds which are thermally resistive, and lead to the same kinds of
unacceptable system failures. For example, PCMAs containing indium are incompatible with bare
copper surfaces, and those containing gallium are incompatible not only with copper but also
with aluminum.

Nickel plating or other deposited materials are necessary to ensure compatibility
between these materials.
Enerdyne Solutions has developed proprietary modifiers and mitigant technologies to
provide PCMA reliability and ensure that Indigo is a robust practical technology for
today's electronics industry. Key patents have been applied for and more filings are
imminent.
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