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Hot Problems
Cool Solutions
PCMA Reliability
Heat Spreaders
Thermal Interfaces
TIM Test Methods
TIM Performance Measures

There are a variety of resources available to learn more about cooling problems and approaches, thermal management, and the theory, principles and techniques of removing heat from devices.

Hot Problems

Heat is fatal to electronics, and the problem of mitigating that heat is an increasingly troublesome and expensive problem for the electronics industry. Read more…

Cool Solutions

The basic computer chip solution of cooling by air circulation is used in desktop computers, many servers and game boxes, and some laptops. There are many other approaches; some of those in greater use include liquid cooling, phase change materials, heat pipes, and spray cooling. Read more…

PCMA Reliability

While liquid metal alloys offer superior thermal performance, PCMA thermal interface materials have variously suffered from corrosion, oxidation, drip-out, pump-out, shake-out, or intermetallic compound formation. Read more...

Heat Spreaders

The heat generated by Integrated Circuit and discrete semiconductor chips has a damaging and limiting effect on performance. Thermal spreader technology allows a concentrated area of high heat to be distributed over a larger area, thereby reducing the average temperature of the chip. Read more…

Thermal Interfaces

One or more heat dissipation or cooling components are typically attached to a chip in order to cool it. This attachment is done with one of the many kinds of Thermal Interface Materials (TIMs), providing mechanical and thermal benefits to the overall solution. Read more…

TIM Thermal Testing Methods

Several methodologies can test thermal performance of TIMs, or thermal interface materials. Laser Flash Diffusivity and ASTM D5470 apply well towards thin, surface-wetting materials, while the IR Camera method may be used where lower resolution is acceptable. Read more…

Comparing TIM Performance

Conductivity, resistance, and impedance are three key terms that are largely relied upon to determine the heat-conduction performance of a thermal interface material. Each term has specific confusions, limitations, or definitions that require clear understanding in order to effectively compare interface materials on the market.
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Other sources of further information:

You can also contact us and we’ll be happy to provide what information or references we can that would be helpful to your particular situation. Tell us about other useful resources that we can add to this page; we’d be grateful for the reference and would be pleased to add them here.

 
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