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There are a variety of resources available to learn more about cooling problems and
approaches, thermal management, and the theory, principles and techniques of removing
heat from devices.
Heat is fatal to electronics, and the problem of mitigating that heat is an increasingly
troublesome and expensive problem for the electronics industry.
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The basic computer chip solution of cooling by air circulation is used in
desktop computers, many servers and game boxes, and some laptops. There are
many other approaches; some of those in greater use include liquid cooling,
phase change materials, heat pipes, and spray cooling.
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While liquid metal alloys offer superior thermal performance, PCMA thermal interface
materials have variously suffered from corrosion, oxidation, drip-out, pump-out,
shake-out, or intermetallic compound formation.
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The heat generated by Integrated Circuit and discrete semiconductor chips has a
damaging and limiting effect on performance. Thermal spreader technology allows a
concentrated area of high heat to be distributed over a larger area, thereby
reducing the average temperature of the chip. Read more…
One or more heat dissipation or cooling components are typically attached to a chip in
order to cool it. This attachment is done with one of the many kinds of Thermal Interface
Materials (TIMs), providing mechanical and thermal benefits to the overall solution.
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Several methodologies can test thermal performance of TIMs, or thermal interface
materials. Laser Flash Diffusivity and ASTM D5470 apply well towards thin, surface-wetting
materials, while the IR Camera method may be used where lower resolution is acceptable.
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Conductivity, resistance, and impedance are three key terms that are largely relied
upon to determine the heat-conduction performance of a thermal interface material.
Each term has specific confusions, limitations, or definitions that require clear
understanding in order to effectively compare interface materials on the market.
Read more…
Other sources of further information:
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