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With Enerdyne Solutions, a wide range of electronic devices' thermal problems
can be solved, offering great flexibility in benefits gained. Enerdyne technology
relieves hot spots and other cooling
difficulties, which allows higher performance for desktops,
reduced fan noise from server farms, smaller sizes
for wireless handsets, and more.
As high-power chip density intensifies, locally overheated areas on a die become
increasingly hazardous to the speed and reliability of the device. Polara
excels as an anisotropic heat spreader, actively dispersing hot spots
to cooler regions along the die perimeter.
Polara's application in today's typical
CPU can save a manufacturer more than $3 per unit. These savings can
allow smaller heat sinks, increased clocked speeds, or simply greater profits.
Improved performance, reduced thermal solution cost, and quieter operation are
all enabled by use of Polara in game
consoles. In some cases, for instance, the fan may be eliminated altogether.
The emphasis with servers and workstations is on
speed and throughput. The accelerated pumping of heat by Polara
helps relieve airflow problems as well as server performance and noise levels.
GaAs MESFET RF amplifiers are used extensively in wireless consumer devices
and industry infrastructure. Polara modeling exhibits
a decrease in junction temperature by 30ºC or more, doubling the
thermal performance of RF amplifiers.
Polara can improve laser module
performance in key ways: by doubling as a heat spreader and submount it
increases efficiency and reduces manufacturing costs, and by establishing
isothermal operation it ensures uniform wavelengths from multiple emitters.
For IGBT/MOSFET transistors Polara is an
improvement over ceramics by improving thermal performance and reducing
substrate costs. Polara satisfies additional needs including dielectric
isolation and conductive layers.
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