Die-Level Thermal Planarization

A Polara™ solution can be tailored to reduce any excessive temperature on a die, facilitating the further densification or redistribution of circuitry. Typical IC chips contain various types of circuitry including: memory, I/O, registers and arithmetic logic. The varying levels of power consumed by each circuitry type create localized hot-spots within the die which limit the chip's speed and reliability. Polara effectively spreads out the hot spots to cooler regions along the die perimeter.

Polara has multiple package or die-level integration options, where greater integration means greater performance gain. An external, discrete option between the package and heat sink may allow for easiest production, whereas direct bond with the die allows for most effective hot spot mitigation. See more detail on deployment.