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| July 2007 |
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| Enerdyne presented and exhibited at the
ASME – JSME Thermal Engineering and
Heat Transfer Conference / InterPACK 2007
Westin Bayshore Hotel, Vancouver, BC Canada; July 8-12, 2007. |
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| May 2007 |
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| Enerdyne exhibited at ECTC
Nugget Hotel & Casino, Reno, NV; May 29 - June 1, 2007. |
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| March 2007 |
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| Enerdyne exhibited at Semitherm XXIII
The Fairmont Hotel, San Jose, CA; March 20-22, 2007. |
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| February 2007 |
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| Enerdyne exhibited at the MEPTEC "The Heat is On" Symposium on thermal
management in microelectronics
Holiday Inn (formerly Hyatt), San Jose, CA; February 15, 2007. |
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| September 2006 |
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| Enerdyne attended IMAPS ATW on Thermal Management
Dinah's Garden Hotel,
Palo Alto, CA;
September 10-13, 2006.
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| July 2006 |
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| Enerdyne attended Semicon West 2006
Moscone Center,
San Francisco, CA;
July 10-14, 2006.
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| May 2006 |
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| Enerdyne exhibited and presented
at the joint ECTC / ITherm conference
Nautilus Hall,
Sheraton San Diego Hotel & Marina, San Diego, CA;
May 30-June 2, 2006.
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| March 2006 |
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| Enerdyne exhibited at SEMI-THERM 22
Intercontinental Hotel, Dallas, Texas; March 14-16, 2006.
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| February 2006 |
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| Enerdyne participated in the MEPTEC Symposium on Thermal Management at
Hyatt San Jose / Mediterranean Center,
San Jose, CA; February 16, 2006.
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| October 2005 |
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| Enerdyne presented at IMAPS/ATW at
Dinah's Garden Hotel,
Palo Alto, CA; October 23 - 26, 2005.
Chris Macris presented "Processor Performance,
Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System".
Manuscript and
slides.
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| September 2005 |
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| Enerdyne attended Therminic 2005 at
Villa Carlotta, Lago Maggiore, Belgirate, Italy; September 27 - 30, 2005.
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| August 2005 |
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| Enerdyne Solutions participated at the 2005 Cooling
Zone Summit August 17-18, Crowne Plaza Hotel, Natick, MA
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July 2005 |
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| Enerdyne leads Packaging and Electronics Cooling Workgroup at 2005 MicroNano Breakthrough
Conference,
July 25 - 28, 2005; University Place Conference Center,
Portland, OR
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July 2005 |
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| Enerdyne attends SemiCon West
2005, July 11 - 15, at the Moscone Center, San Francisco, CA.
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June 2005 |
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| Enerdyne presents at the Next-Generation
Thermal Management Materials and Systems Conference,
organized by the RTI Technology Venture Forum, June 15-17, at the Wyndham
Buttes Resort, Tempe, AZ.
Chris Leyerle presents "The Ten
Myths of Liquid Metal Thermal Interfaces"
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May 2005 |
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| Enerdyne exhibited at the 55th Electronics Component Technology Conference (ECTC), May 31-June 3, at the Wyndham
Palace Resort & Spa, Lake Buena Vista, FL.
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| April 2005 | 
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| Enerdyne Solutions presents at the
Early Stage Investment Forum (ESIF) hosted
by the Northwest Entrepreneur Network (NWEN) and held on
Wednesday, April 20, 2005 at the Bell Harbor Conference Center in Seattle.
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| March 2005 |
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| Enerdyne exhibits at Semi-Therm XXI.
March 15-17, 2005, Fairmont Hotel, San Jose, CA. |
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| November 2004 | Ishaque S.
Mehdi, Chief Engineer at Boeing's
Phantom Works joins the Enerdyne Solutions Advisory Board. |
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| November 2004 |
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| Enerdyne exhibits and presents at the International Microelectronic Application
Packaging Society annual conference, IMAPS 2004
November 16-18, Convention Center, Long Beach, CA.
Chris Macris presents "Performance, Reliability, and
Approaches using a Low Melt Alloy as a Thermal Interface Material"
Chris Leyerle presents "Indigo Thermal Interface System with TIM
impedance < 0.04 °C-cm²/W"
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| October 2004 |
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| CTO Chris Macris presents paper
"Reliability and Performance of a Low Melt Alloy-based Thermal Interface System" at
Thermal 2004 IMAPS ATW, Palo Alto, CA.
October 25-27, Sheraton Hotel, Palo Alto, CA
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| August 2004 |
 
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| Enerdyne Solutions unveils new logo and brand design. Company
President Chris Leyerle noted that response to the new look has been very positive:
"Many of our customers have remarked on the clean, compelling design, and the way
the logo elegantly embodies our approach of effective cooling right at the heat source.
We are very pleased how this design captures our approach and alludes to our core
professional competencies in the analysis, design, and realization of high-performance
and cost effective thermal solutions."
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| August 2004 |
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| Enerdyne Solutions participated at the 2004 Cooling
Zone Summit August 25-26, Crowne Plaza Hotel, Natick, MA
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| June 2004 |
 |
| Enerdyne and Washington State University awarded $40,000
from the Washington Technology Center. Press Release: Enerdyne
Solutions Wins Grant for Cooler Wireless Devices
The Phase 1 Research & Technology Development Program grant funds collaboration between Enerdyne and
Professors George
LaRue and Mohamed Osman at
Washington State University. This joint effort will develop a GaAs RF Amplifier
device, for use in wireless communications and radar applications, which has 2-3X
higher thermal performance, enabling a doubling of device output while reducing the size,
weight and cost of the overall thermal solution.
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| June 2004 | United States Patent and Trademark Office issues
the Company’s 7th patent |
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| June 2004 |
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| Enerdyne exhibits at the joint ECTC / ITherm conference, June 2-3 at Caesar’s
Palace, Las Vegas, NV |
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| May 2004 |
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| Enerdyne presents at the Semiconductor Venture Fair, May 11-12
at the Wyndham Hotel, San Jose, CA |
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| April 2004 | United States Patent and Trademark Office
issues the Company’s 6th patent |
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| March 2004 |
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| Enerdyne exhibits at Semi-Therm, March 9-10 at the
Fairmont Hotel, San Jose, CA |
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| February 2004 | United States Patent and Trademark Office
issues the Company’s 5th patent |
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| October 2003 | Chief Scientist Chris Macris presents
paper "Cooling Microelectronics with
Thermal Raceways" at Thermal 2003 IMAPS ATW, Palo Alto, CA |
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