Enerdyne Solutions



May 29, 2007	Press Release: Enerdyne Solutions and Indium Corporation of America Sign Agreement


April 15, 2005	Press Release: Enerdyne Solutions Selected to Present at Investment Forum


July 2, 2004	John Cook, business columnist for the Seattle P-I talks about Enerdyne’s grant award from the Washington Technology Center in his column: Venture Capital: Grants can turn ideas into reality


July 1, 2004	Press Release: Enerdyne Solutions Wins Grant for Cooler Wireless Devices


May 2004	Terry Thompson, Senior Editor for Chip Scale Review Magazine features Enerdyne in the special issue on Thermal Management: If You Can’t Stand the Heat, Think Sink!

Enerdyne Solutions